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G109 75Grams Thermal Glue, Thermal Conductive Plaster, Silicone Viscous Adhesive Compound for LED GPU Chipset Printer MOSFET Heatsink Cooling SealingDescription Item model number GN109-75 Item Package Quantity 1 Item Volume 50 Milliliters Material Silicone Item Form Paste Package Dimensions 7 x 1.6 x 1 inches; 2.82 Ounces
- Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
- Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
- It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius)
- Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
- Package Includes : 1 x GENNEL G109 75g thermal glue
Product Description Model GENNEL G109 Color White Net Weight 75g Operating Temperature -60℃ ~ 280℃ (-76℉ to 536℉) Package Includes 1 x GENNEL G109 75g thermal glue, 1 x Spatula.
- Features: It has heat conducting properties, strong adhesion.
- Suitable for all heatsink without fixed clip.
- Helps disperse the heat from Chipset to heatsink effectively.
- Do not use thermal glue between CPU and HEATSINK.
- The curing rateis related to the relative humidity and temperature in the air, the higher the temperature, the faster the curing speed, and vice versa.
- Recommended coating thickness: 0.1-0.5mm, the thinner the better.
- Please close the lid immediately after use to prevent the glue from curing.
Safety Application
Non-electrical conductive,non-volatile, flame retardant, which eliminates the risk of short circuit and discharges and corrosion damage to the chip and the radiator.
Long-lasting and stable performance
Excellent ease of use and outstanding long-term stability.
Wide working temperature
Wide working temperature: -60℃ ~ 280℃ (-76℉ to 536℉)
Wide range of applications
Use for MOSFET, LED, heat sinks , North-south bridge, graphics card , Printer, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
