High Thermal Conductivity • Non-Electrically Conductive High Thermal Conductivity Grease Compound (4g Syringe)
Advanced Nano-Molecular Formula • 12.4 W/mK Cooling • 8-Year Service Life
⚡ Maximize Heat Transfer & Protect High-Performance Electronics
Maximize heat transfer and protect your high-performance electronics with this unbranded High Thermal Conductivity Grease Compound (4g Syringe). Engineered with advanced nano-molecular technology, this silicone compound fills micro-gaps between heat spreaders and cooler bases to lower thermal resistance (0.05 °C-cm²) and deliver rapid cooling up to 12.4 W/mK.
Formulated for gaming PCs, CPUs, GPUs, gaming consoles (PS5, PS4, Xbox), and laptops, it provides a safe, non-electrically conductive, and non-corrosive interface that prevents short circuits on sensitive components.
Featuring an ideal density (350 Pa·s) for smooth, effortless application without running or drying out, this long-lasting compound offers up to an 8-year service life for long-term cooling reliability.
✨ Key Product Highlights 🔥 Ultra-High Thermal Conductivity (12.4 W/mK):
Advanced nano-molecular formulation rapidly draws heat away from high-load processors.
📉 Low Thermal Resistance (0.05 °C-cm²):
Micro-particle structure fills surface imperfections to minimize thermal bottlenecks.
⚡ Non-Conductive & Safe Application:
Metal-free, non-electrical conductive formula eliminates the risk of short-circuiting expensive components.
⏳ Non-Curing & High Durability:
Resistant to high operating temperatures; will not dry out, crack, or compromise over time with an 8-year service rating.
🎮 Universal High-End Compatibility:
Perfect for gaming desktop processors, graphics cards, PS5/PS4/Xbox consoles, laptop heatsinks, and LED heat spreaders.
📊 Technical Specifications 📌 Buyer Sizing & Usage Disclaimer: This order includes one (1) individual 4g syringe of thermal paste. Please check your component cooling requirements prior to purchase. A 4g volume provides approx. 4–8 typical CPU/GPU applications depending on chip surface area. Allow a minor net weight variance tolerance of ±0.2 g. Specification American Standard Units International Metric Units Net Content Weight 0.141 oz 4 g Syringe Thermal Conductivity 12.4 W/mK 12.4 W/mK Thermal Resistance 0.05 °C-cm² 0.05 °C-cm² Viscosity / Density 350 Pa·s 350 Pa·s Rated Service Life Up to 8 Years Up to 8 Years Electrical Conductivity Non-Conductive (0 Electrical Conductance) Non-Conductive (0 Electrical Conductance) Physical State Non-Curing Thermal Silicone Paste Non-Curing Thermal Silicone Paste Color Gray Compound Gray Compound Brand Designation Unbranded Unbranded Country of Manufacture China China
💻 Uses & How to Apply
💡 Recommended Applications: Intel & AMD CPUs, NVIDIA & AMD Radeon GPUs, Sony PS5 / PS4 / PS3, Xbox Series X/S / One, laptop heat pipes, and high-power LED modules.
📋 Step-by-Step Directions:
1. Clean Surface: Remove old thermal compound from both CPU/GPU chip and cooler base using isopropyl alcohol and a lint-free cloth.
2. Apply Compound: Dispense a small pea-sized dot (approx. 4–5 mm diameter) or thin "X" pattern in the center of the heat spreader.
3. Mount Cooler: Place the heatsink directly on top and tighten mounting screws evenly in a cross pattern to spread the paste smoothly.
🛡️ Product Safety & Handling Guidelines ⚡ Safe Electrical Insulation:
Formulated as non-electrical conductive; safe if small amounts overflow onto PCB substrate.
🌡️ Storage Instructions:
Store at room temperature away from direct sunlight. Cap the syringe tightly after use to maintain optimal viscosity.
📦 Package Content Inventory List
1 x Unbranded 4g Thermal Compound Dispensing Syringe
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