Overview
Upgrade your graphics card cooling with the Thermalright ODYSSEY Thermal Pad, a high-performance thermal interface material rated at 12.8 W/mK. It efficiently bridges the gap between hot components and your heatsink, helping to pull heat away from GPU cores, memory chips and VRM modules for more stable temperatures under load.
The pad is non-conductive and non-corrosive, making it a safe choice for delicate electronics. Its soft, compliant texture fills uneven surfaces and small gaps, so it conforms tightly to components without the mess of traditional paste. Ideal for gamers, PC builders and repair technicians who want reliable cooling performance.
Key Features
- Brand: Thermalright
- Model: ODYSSEY Thermal Pad
- Type: Thermal Pad
- Thermal Conductivity: 12.8 W/mK
- Material: Silicone-based thermal compound
- Available Thickness: 0.5 / 1.0 / 1.5 / 2.0 / 2.5 / 3.0 mm
- Electrical Properties: Non-conductive and non-corrosive
Highlights
- ✓ High 12.8 W/mK conductivity helps lower GPU and memory temperatures
- ✓ Non-conductive formula is safe to use around sensitive circuits
- ✓ Soft, gap-filling pad conforms to uneven surfaces for full contact
- ✓ Easy to cut and apply, no curing or messy paste required
- ✓ Suitable for GPU, RAM and chipset cooling upgrades
Usage
Cut the pad to the required size, peel off the protective film and place it between the component and the heatsink or water block. It is well suited to graphics card teardowns, laptop cooling maintenance and custom water-cooling builds.
In the Box
- 1 x Thermalright ODYSSEY Thermal Pad
Please Note
- Please confirm the exact thickness and color variant you need before ordering, as multiple options are available.
