UTP-6 Thermal Putty, Cooling Pad for GPU VGA IC Processor 100g

Application Notice: Not for use as silicone grease on CPUs. It is a high-performance, fully cured thermal management material for electronic assemblies and will not dry out over time.

Dispensing Performance: Features low viscosity suitable for dispensing. Excellent adhesion to heat sinks and compatible with auto-dispensing equipment & stencil screen-printing.

Wide Usages: Perfect for rework and field maintenance. Compared with thermal pads, it fills gaps completely with good compressibility and reduces overall costs.

Safety Standard: compliant and halogen-free. Safe to apply in projects that restrict hazardous substances.

It cannot be used as silicone grease on CPUs. This high-performance, fully cured thermal management material is designed for electronic assemblies and will not dry out. Featuring low viscosity for dispensing applications, it offers great adhesion to heat sinks and works well with auto-dispensing equipment or stencil screen-printing. Ideal for rework and field repair scenarios. Unlike traditional thermal pads, this material fully fills gaps with reliable compressibility to cut costs. It meets standards and is halogen-free, offering safety assurance for applications prohibiting hazardous substances.