It cannot be used as silicone grease on CPUs.This high-performance, fully cured thermal management material is designed for electronic assemblies and will not dry out.Featuring low viscosity for dispensing applications, it offers great adhesion to heat sinks and works well with auto-dispensing equipment or stencil screen-printing.Ideal for rework and field repair scenarios.Unlike traditional thermal pads, this material fully fills gaps with reliable compressibility to cut costs.It meets RoHS standards and is halogen-free, offering safety assurance for applications prohibiting hazardous substances.