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2/4 Pack Thermal Pad,100X100Mm 0.5Mm 1Mm 1.5Mm 2Mm Highly Efficient Thermal Cond
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2/4 Pack Thermal Pad,100X100Mm 0.5Mm 1Mm 1.5Mm 2Mm Highly Efficient Thermal Cond
Price: US $21.29
  • 0.5mm 1mm 1.5mm 2mm
  • Excellent thermal conductivity: Made of thermal silica gel with heat conductivity of 6.0 W/mK
  • Reliable & Durable: High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
  • Application: Thermal Pad used in the control board of electronic and electrical products;Pads and foot pads inside and outside the motor; Appliances, automotive machinery, computer hosts, notebook computers, DVDs, VCDs, and any materials that require filling and cooling modules.
  • Convenient & Affordable - Dimension 100x100mm, the thermal pads can be cut freely according to your needs. 0.5mm,1mm,1.5mm,2mm/set can meet different needs.
  • Package include: 0.5mm,1mm,1.5mm,2mm thickness each 1pcs, total 4pcs.

1mm & 1.5mm
  • ❀ Thermal Adhesive Tape is a simple and practical tape, easy to install, easy to use, easy to eliminate.
  • ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression.
  • ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression.
  • ❀ EFFICIENT THERMAL CONDUCTIVITY - The Thermal Pad based on silicone & a special filler outperforms generic and performance pads by far. The Thermal Conductivity amounts to 2.0 W/mK.
  • ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression. ✔Widely used in most electronic devices,High tensile strength and strong adhesion hold the device firmly in place, to achieve the most effective thermal dissipation
  • ❀ Used for fill the uneven surface,Can be tightly and firmly fit the heat source devices and heat sink,heat sink and IC chip bonding, high power LED and heat aluminum bonding.


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