Room-temperature curing underfill thatreinforces BGA packages, coats solder balls, and helps equalize heat; non epoxyand nontoxic; stable up to 250 °C; designed for reball/reflow repair work flowsin professional workshops.
Description:
BGA COAT is a professional underfill/coating system designed to strengthen BGAcomponents after reballing or reflow and to protect the solder ball array fromenvironmental stress. Once applied, it forms an interconnection between the BGApackage and the PCB and creates a protective perimeter coating around theballs, reducing the chance of joint fracture after shock or vibration andlimiting oxidation and tin whisker growth. It also offers good thermalconductivity*, helping to equalize temperature at the base of the package and,where design allows, assist heat flow toward the system heat sink. Non-toxicand non toxic, it is intended for use by trained technicians.
Mix Binder A with Filler B at a 2:1 ratio,apply around the BGA/PCB gap, and allow a full room temperature cure(approximately 48 hours). Do not power the board until curing is complete.Tools can be wiped clean before the mixture sets; after hardening, removal isonly by mechanical means. The cured material maintains form up to 250 °C.
Packet includes:
• 2 × 25 ml Binder A (50 ml total)
• 1 × 25 g Filler B
• 1 × dispenser with ml markings
• 1 × application spatula
• 1 × storage box
The kit yields roughly 70 ml of mixed BGACOAT—enough for many jobs, as typical BGAs require about 0.5 ml. Designed forprofessional workshops that need an underfill available in practical quantitiesrather than industrial-only packaging.
*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).
Bullets:
• Structural reinforcement for repairs: forms a perimeter underfill that bondsthe package to the PCB and coats the solder ball field, reducing the risk ofjoint fracture after handling, transport, or drop events while limitingoxidation and whisker growth.
• Thermal assistance where it matters: the cured material exhibits good thermalconductivity*, helping to even out localized hot spots at the base of the BGAand supporting heat flow toward the device’s cooling path when design permits.
• Professional-grade formulation: non-epoxy and nontoxic for workshop use;supplied in quantities suitable for small labs and repair centers rather thanindustrial bulk only.
• Practical curing workflow: room-temperature cure in about 48 hours; keepboards unpowered during cure; cured material withstands up to 250 °C, aligningwith common rework temperature envelopes.
• Efficient coverage and yield: kit produces roughly 70 ml mixed volume—enoughfor many repairs since most BGAs consume about 0.5 ml—supporting repeatable, cost-effectiveservice.
• Complete toolkit in the box: measured dispenser, spatula, and storagecontainer accompany Binder A and Filler B so technicians can mix accurately andapply cleanly without sourcing extra accessories.
Tags: BGA underfill; reball/reflow repair;non epoxy; thermal coating
Keywords:BGA COAT, underfill, BGA reinforcement, solder ball coating, thermalequalization, reballing, reflow, GPU repair, CPU repair, PCB protection, non epoxy,nontoxic, 2:1 mix ratio, room temperature cure, 48-hour cure, 250 °C stability,electronics workshop, repair lab, spatula and dispenser, 70 ml yield
