Coldium Thermal Pad Origins Advanced Premium Thermal PAD- 50 x 50 mm - Thickness: 0.5 mm
Thermal conductivity: 15.4W/m-k
Based on advanced technology, Coldium pads exhibit outstanding, reliable physical and chemical thermal conduction performance and lower compression set. Its intrinsic adhesion and soft polymer structures ensure bridging the irregular gap. Voids to optimize heat dissipation without sacrificing thermal performance by laminating with additional adhesives or other surface treatments.
Eco-friendlyEasy applicationNon-electrically conductiveSoft and thermal conductivityHigh insulation compatibilityLow outgassing and durable aging performanceHigh inflation and flexibilityGood workability and ultra-thin offeringWide range of thickness optionsCost-saving solutions
Typical applications:Laser equipmentHigh-power density LED modulePower supplies, UPSTelecommunication equipment, 5G module unitsMilitary gadgets, radar, power invertersSignal transmitter, PC peripherals