Key Features

• Supports Intel Socket LGA 1700/1851
• Copper Heatsink with Skiving Fins
• Supports up to 195W TDP
• Pre-applied Shin-Etsu X23-8195 Thermal Grease
• Dimensions: 3.7" x 3.7" x 1.06"

Product Brief

Recommend for Intel Alder Lake S Processor, Socket LGA 1700/1851, Copper heatsink with skiving fins. Support 195 Watts CPU Power Heat Dissipation for 1U & Up Server Solution.

Manufacturer Dynatron Product ID Q17 CPU Support Socket LGA 1700/LGA1851
Up to 195W TDP
Dimensions 94 x 94 x 27mm
3.7" x 3.7" x 1.06" (in inches, approximate)
Features Shin-Etsu X23-8079-2 Thermal Grease

International Shipping Details

• Import taxes, customs duties and all associated fees during importation will be the responsibility of the purchaser.
• Please note that USPS does NOT guarantee delivery dates for their international services. Therefore, we cannot Provide a guaranteed delivery date if you choose USPS international mailing services.
• USPS Priority Mail International has an estimated delivery transit time of 6-11 business days.
• USPS Express Mail International has an estimated delivery transit time of 3-5 business days.
• In addition to the estimated delivery time, you should expect additional delay due to customs control and Processing times by the local postal authority in your country.
• No transit-time estimates are available for USPS First Class Mail International packages and no tracking information is available.
• If you have any time constraints, please ship Express Mail service.
• If you require tracking information and insurance, select Express Mail service.
• For more information on international shipping, please visit: MITXPC/International-Shipping
• Please review our store policies here: MITXPC/Store-Policies