Properties

Color: white

Surface drying time: 2-8 min

Hardness (Shore A): 45-75

Tensile strength (MPa): 2.0

Elongation: 100%

Adhesion and tensile strength(MPa): 1.5-2.0

Thermal conductivity(W/m.k): > 0.975

Working temprature range: -76 to 392 F (-60 to 200C)

Non-Electrical Conductive

Volume resistance(c-in/W): < 2.0x10^15

Dielectric strength(KV/mm): 20

Dielectric constant: 3.0

Dielectric loss factor(60Hz): 0.003

Continuous use temp: 200℃

Content:

Silicone material: 30%

Thermal conductive material: 40%

Strengthen fillers: 20%

Crossing agent: 10%

Premium thermal glue for bonding and conducting heat at the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, Thermoelectric Peltier Cooler Module

10 gram high performance thermal glue with strong adhesion.
Thermal conductivity > 0.975 w/mk
Thermal Impedance: < 0.06
Non-Electrical Conductive, Non-corrosive ,Non-toxic, High Performance, Working at High temprature for cooling electronics, robotics.
Premium thermal glue for bonding and conducting heat at the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, Thermoelectric Peltier Cooler Module