High-Performance Silver Paste
12g 2-Pack
Overview:
Unleash the full potential of your high-powered processors with our High-Performance Silver Paste. Formulated with 99.9% pure micronized silver, it is meticulously designed to maximize thermal conductivity between modern CPUs and cooling assemblies, ensuring optimal performance and longevity.
Key Features:
- Average Particle Size: Less than 0.49 micron (less than 0.000020 inch) for exceptional thermal conduction.
- Extended Temperature Limits: Peak temperatures ranging from -50°C to over 180°C; long-term stability from -50°C to 130°C.
- Performance Enhancement: Achieve 3 to 12 degrees centigrade lower CPU core temperatures under full load compared to standard thermal compounds or pads.
- Generous Coverage Area: A 3.5-gram syringe covers approximately 16 square inches, suitable for 15-25 small CPU cores or 2-5 heat plates.
- Innovative Particle Design: Composed of three unique shapes and sizes of near-pure silver particles to maximize particle-to-particle contact and thermal transfer.
- Controlled Viscosity: Allows the compound to fill microscopic valleys and gaps in CPU and heatsink surfaces over time.
Why Choose Our High-Performance Silver Paste?
Say goodbye to overheating issues and enhance the performance of your processor with our silver paste. Unlike standard silicone thermal pastes, it can reduce CPU core temperatures by up to 50°F, ensuring a cooler, quieter, and more efficient working environment. Engineered for demanding conditions, this thermal compound is the ideal choice for gamers, overclockers, and professionals seeking to maximize their systems’ power.
Upgrade to superior thermal management today—experience the difference and let your system perform at its best!
Unit Quantity: 0.32Material: Copper,SilverTo Fit: CPUType: Thermal CompoundColor: SilverPackaging: SyringeUnit Type: oz
