Bulk workshop jar for production and fleetservice; apply and forget, nonconductive paste that spreads thin, fillsmicrogaps and stays stable up to 220 °C in industrial, commercial and fanlessplatforms.
Description:
K4 PRO 500g is a high capacity jar of our low viscosity, silicone-based thermalpaste designed for installations that are serviced once and then left to runreliably. It forms a thin, uniform, wetting film that maintains contact acrossmicroscopic gaps between heat sink and component, supporting consistent heatflow over long operating lifetimes. With thermal conductivity >4.6 W/m·K*,electrical nonconductivity and operating stability up to 220 °C, it is wellsuited to production lines, refurbishers and labs building business desktops,terminals, kiosks, network appliances and embedded systems that will not beroutinely reopened.
The 500 g jar offers economical coveragefor multidevice projects and ongoing maintenance across fleets. Decant smallportions into cups for precise work while keeping the main jar sealed topreserve texture and cleanliness over long service cycles.
K4 PRO is equally at home in industrial andfanless designs where heat sink cleaning is infrequent or impractical. When adevice also uses soft pads around memory or power stages, pair K4 PRO on theCPU/GPU die with K5 PRO on surrounding components to restore end-to-endcontact. K4 PRO is compatible with Apple iMac and Sony PlayStation 2, alongwith other devices that specify a standard thermal paste interface on the maindie.
Packet includes:
• 1 × 500 g jar of K4 PRO silicone thermal paste
*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).
Bullets:
• Built for longevity in production and fleet service: silicone formulationkeeps a stable, wetting film that resists dry out, preserving heat sink contactthrough years of duty cycles and temperature swings.
• low viscosity spread that fills microgaps and machining marks to maximizereal contact area at low clamp force, reducing hotspots without repeatedreseating.
• Proven thermal capability: conductivity >4.6 W/m·K* with electricalnonconductivity and temperature stability to 220 °C, appropriate for sealed,fanless and industrial enclosures.
• Ideal when routine reopening isn’t planned—business PCs, terminals, kiosks,embedded controllers and network appliances—where “apply and forget”performance is critical.
• Pairs effectively with K5 PRO on the same device: K4 PRO covers the dieinterface while K5 PRO handles VRAM/VRM gaps, a combination used successfullyon iMac video boards and PS2era consoles.
• Bulk 500 g jar supports labs and production benches: decant working amountsto maintain cleanliness and consistent texture across long projects andmultiunit batches.
Tags: silicone thermal paste; bulk jar;long life; nonconductive
Keywords: K4 PRO thermal paste, siliconeTIM, bulk 500 g, >4.6 W/m·K*, apply and forget, production line,refurbishing, fleet maintenance, fanless systems, industrial controllers,embedded devices, CPU paste, GPU paste, heat sink interface, pairs with K5 PRO,iMac compatible, PlayStation 2 compatible, long term stability, decantingworkflow, made in EU
