Three 20 g jars for active benches andparallel work flows; solves over 90% of pad replacement cases; fills up to 3 mm(≈1 mm optimal); stable from −90 °C to 250 °C.
Description:
K5 PRO 3x20g equips your bench with three 20 g jars of our viscous,nonconductive thermal putty—recognized worldwide since 2013 for accessible,repeatable pad replacement. It spreads smoothly, holds its shape, and maintainscohesive contact over uneven surfaces, restoring dependable heat transferwithout stacking pads or guessing thickness.
With 60 g total split across three jars,this shop pack supports busy teams while preserving freshness. Keep one jardedicated to microscope only work, one for general service, and one sealed asinventory. The split format minimizes exposure to dust, simplifies stockrotation, and ensures consistent texture from first application to last.
As a daily solution, K5 PRO covers the vastmajority of pad replacement scenarios on laptops, desktops, and consoles. Itspreads smoothly, holds its shape, and maintains cohesive contact betweencomponents and heat sinks—even across uneven surfaces and around heightvariations—so you can restore reliable heat transfer without hunting for exactpad thicknesses.
Beyond standard repairs, K5 PRO also solvesthermaltransfer challenges in custom or compact builds. Use it to create acontrollable heat bridge from hot components to metal housings or frames indevices such as home routers, access points, LED light bars/panels, DVRs/NVRs,and singleboard computer enclosures. Users around the world have reported lowermemory temperatures, quieter fans, and improved stability after replacing agedor poorly sized pads, with consistent gains when dealing with mixed gap heightsand irregular interfaces. Store sealed, away from frost and dust; keep in acool, dry place to maintain long term stability.
Packet includes:
• 3 × 20 g jars of K5 PRO thermal putty
• 1 × wooden applicator
• 1 × instruction leaflet
*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).
Bullets:
• Establishes a stable, shapeable interface that equalizes irregular gaps forproper heat sink seating and consistent thermal transfer across VRAM/VRM andframeedge contact points.
• Packaging advantage – 3 × 20 g jars: 60 g total for frequent service whilekeeping each jar fresh; assign jars to benches or technicians, and rotate stockeasily.
• Bridges gaps up to 3 mm (≈1 mm optimal) without sag; particularly effectivewhere mixed component heights and standoffs make pad selection difficult.
• >5.3 W/m·K* thermal conductivity and a −90 °C to 250 °C operating window;electrically nonconductive and easy to rework during future service.
• Supports DIY and workshop projects, including heat bridging to metal housingsin routers, LED assemblies, DVRs/NVRs, and compact embedded systems withlimited airflow.
• K5 PRO is compatible with Apple iMac, Acer Nitro, ASUS ROG, MSI laptops,PlayStation 4, Nintendo Switch, Xbox One, and NVIDIA GeForce GTX 10seriesboards.
Tags: thermal putty; shop pack; DIY repair;nonconductive
Keywords: thermal putty, thermal pad replacement, 3×20 g jars, shop pack, VRAMcooling, VRM cooling, gap filler, nonconductive TIM, parallel benches, stockrotation, decanting, laptop repair, console repair, chassis heat bridge, LEDassemblies, router cooling, 3 mm gap, repeatable results, trusted since 2013,EU made
