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MSI MAG B850M MORTAR MAX WIFIKey Specifications - Form Factor: M‑ATX (Micro‑ATX)
- CPU Socket: AM5, Chipset: AMD B850
- CPU Support: Full range of Ryzen 7000 / 8000G / 9000 series (R5‑9600X, R7‑9700X, R7‑9800X3D compatible)
- Power Delivery: 14+2+1 Duet Rail power stage, 80A SPS DR.MOS, dual 8‑PIN CPU power connectors; 8‑layer PCB with 2oz thickened copper foil, heat sinks with 7W/mK thermal pads; equipped with OC‑Engine clock generator, supports BCLK base‑clock overclocking
- Memory: 4×DDR5 DIMM dual‑channel slots, max 256GB capacity; EXPO overclock up to 8400+ MT/s, supports CUDIMM memory; Memory Boost signal optimization for lower memory latency
- Storage: 4×M.2 slots (2×PCIe5.0 x4 + 2×PCIe4.0 x4) + 2×SATA 6Gbps ports; 2nd‑gen EZ M.2 Frost Shield, tool‑less SSD installation & removal
- GPU Slot: PCIe5.0 ×16 reinforced slot with EZ‑PCIe quick‑release latch for one‑click GPU uninstall
- Network: 5G Ethernet LAN + Wi‑Fi 7 + Bluetooth 5.4
- I/O Interface: HDMI2.1; multiple rear USB 10Gbps ports (including 3×Type‑C); front‑panel USB 20Gbps Type‑C; Audio Boost5 7.1‑channel audio; 3×ARGB V2 headers; TPM2.0; CMOS reset button
- BIOS: 64MB large‑capacity BIOS chip, supports future new‑CPU compatibility updates
Core Selling Points - Enhanced Power Delivery: 14+2+1 phase 80A power solution with dual 8‑PIN CPU power. This M‑ATX board stably drives 9800X3D for gaming, overclocking and productivity workloads.
- Four M.2 SSD Slots: Rare 4‑drive M.2 configuration on M‑ATX form factor, dual PCIe5.0 high‑speed slots. User‑friendly for multi‑storage builds with tool‑less screw‑free installation for easy DIY.
- OC‑Engine Clock Chip: Enables BCLK base‑clock overclocking, raising tuning ceiling for CPU and memory, ideal for enthusiasts.
- Complete EZ DIY Design: GPU quick‑release, tool‑less M.2 brackets, magnetic shark‑fin Wi‑Fi antenna for convenient assembly and disassembly.
- High‑End Network Performance: 5G wired LAN plus Wi‑Fi 7 & Bluetooth 5.4, delivering high‑speed and low‑latency network experience.
- Solid PCB Construction: 8‑layer server‑grade PCB with 2oz copper foil, stable thermal performance under heavy loads, great foundation for memory overclocking.
On Aug 18, 2026 at 20:08:03 PDT, seller added the following information: On Sep 22, 2026 at 23:35:59 PDT, seller added the following information:  |
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