UPSIREN's thermal pad is a game - changer in heat management. It incorporates high - performance filler and advanced polymer technology, ensuring superior thermal conductivity. With a 0.25mm thickness, its upgraded texture prevents splitting, having passed over 1000 tests. Available in both pad and paste forms, it offers easy installation. Phase - changing at 45°C, it efficiently transfers heat, staying solid at room temp and softening upon heating for long - term reliability. Perfect for cooling various electronics.
HIGH THERMAL CONDUCTIVITY: 6.5-8.5W/mK phase‑change thermal sheet adopts premium filler‑polymer material for efficient hardware heat dissipation performance.
STABLE 0.25MM THICKNESS: Optimized texture resists cracking, reliability verified by over 1000 tests for long‑term stable daily operation.
VERSATILE COMPATIBILITY: Works for CPU, GPU, PS5, Steam Deck, M.2 SSD, gaming laptop, notebook and game console chips, pad & paste two forms for easy install.
45°C PHASE‑CHANGE FEATURE: Remains solid under room temperature; softens at 45°C to transfer heat continuously during equipment working status.
RELIABLE DURABILITY: Maintains complete material integrity after repeated heating cycles, avoids deterioration for long‑time cooling service.