UPSIREN UTP-X Ultra Thermal Putty,Cooling Pad for GPU VGA IC Processor,20g 20g
Product Details

• Publisher: UPSIREN
• Publication date: 0

• NOT SUITABLE FOR CPU INSTALLATION: Thermal conductivity over 16.8 W/mK, works as replacement for soft thermal pads up to 3mm thickness to transfer heat for GPU and IC chips.
• NON-CONDUCTIVE & SAFE: It won’t conduct electricity to prevent short circuits, maintaining stable performance under max operating temperature up to 250°C.
• MOLDABLE & EASY TO APPLY: Flexible gummy texture fits uneven chip surfaces. Comes with a spatula for simple and tidy installation operation.
• WIDE COMPATIBILITY: Suitable for GPU, VGA graphics card, memory chips, IC modules, gaming laptops and various commercial electronic components.
• LONG-LASTING DURABILITY: Hardly dries or hardens after long time use, ideal cooling upgrade for PC builders, hardware modders and maintenance workers。

UTP-X Ultra Thermal Putty is a moldable thermal compound engineered for computer cooling modification. Featuring thermal conductivity above 16.8 W/mK, it serves as an ideal substitute for traditional soft thermal pads with thickness within 3mm. Made with non-conductive formula, this thermal putty prevents short circuits while delivering steady heat transfer. The pliable texture fits irregular component surfaces perfectly. It is widely compatible with GPU, VGA video card, memory modules, IC chips and CPU processors for desktop PCs and gaming laptops. Included applicator spatula supports simple installation. Suitable for DIY PC builders, hardware enthusiasts and technicians looking to improve thermal dissipation of electronic devices.