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High-Performance Thermal Pads for Optimal Cooling Experience unparalleled heat management with our upgraded thermal silica gel pads, designed to enhance the efficiency of your electronic devices. Below are the key features and benefits: Excellent Thermal Conductivity - Thermal conductivity of 12.8 W/mK for superior heat transfer.
- Density: 3.1±0.2 G/cc, ensuring optimal performance.
- Hardness: 30~55 Sc, providing a perfect balance between flexibility and strength.
- Breakdown voltage: 9.8KV, ensuring safe operation under high voltage conditions.
- No conductivity issues, effectively cooling temperatures in seconds.
Super Reliable & Durable - High temperature performance ranging from -40 ℃ to 200 ℃ without melting.
- Non-toxic and odorless for safe handling.
- Anti-corrosion and wear-resistant properties for long-lasting use.
- Fire retardant and anti-static features protect your electronics.
- Good insulation ensures no damage occurs when in contact with electrical traces.
Easy & Convenient to Use - Dimensions: 120x20x2.5mm, easily cut to fit your specific needs.
- Perfect for filling gaps on contact surfaces, making it ideal for both beginners and professionals.
Widely Applicable - Replaces traditional heatsink compound grease paste effectively.
- Compatible with PCs, control boards, motors, CPUs, GPUs, heat sinks, power LEDs, gaming equipment, laptops, solid-state drives, and more.
- Ideal for various applications including DVD players, set-top boxes, and LED IC SMD DIP cooling modules.
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