High viscosity, hand moldable compound forwater cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*;engineered for wide tolerances where paste can’t maintain contact.
The 100 g jar provides economical coveragefor labs, refurbishers and power users who service multiple devices insuccession. Decant small portions into cups for microscope work, keep the mainjar sealed between jobs, and maintain consistent texture across long projects.
In watercooled builds and other bigcoolers, cold plates rarely land flat across complex component clusters;standard paste is too thin to bridge those tolerances. UX PRO Ultra holds auniform 2–4 mm layer that stays cohesive under clamp force, so your loop’scapacity translates to real temperature reductions where it counts.
The compound is more viscous and lightlytacky by design, making it easy to shape by hand for precise placement. Form aribbon or pad with the included sleeves, set it on the components, and pressfor a clean, even footprint. Once installed, it resists pumpout and creep undersustained heat. Produced in Thessaloniki, Greece (European Union). Theformulation was developed through scientific research cofunded by Greece andthe European Union.
Packet includes:
• 1 × 100 g jar of UPSIREN UX PRO Ultra thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves
*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).
Bullets:
• Purpose-built for large tolerances: forms a cohesive 2–4 mm interface underclamp pressure where ordinary paste collapses, improving contact overGDDR6/GDDR6X VRAM, VRM stages and controllers.
• High viscosity, hand moldable formulation for precise placement; holds shapeduring assembly, resists pumpout through long gaming, rendering, mining and AIworkloads.
• Maximum possible thermal conductivity for a nonconductive putty (16.8W/m·K*), combining high heat transfer with electrical safety near dense SMDlayouts and vias.
• Bulk 100 g capacity supports multidevice projects and production benches;decant working amounts to minimize exposure and keep the main jar sealed andclean between sessions.
• Ideal for water cooling cold plates and big air coolers alike—bridges unevenfootprints, standoffs and frame edges without resorting to stacked pads thatcompromise uniformity.
• UPSIREN UX PRO Ultra is compatible with PlayStation 5, Xbox Series X, NVIDIAGeForce RTX 3080/3090/4080/4090 graphics boards, AMD Radeon RX 6800/6900/7900series, and other systems using thermal pads or putties.
Tags: thermal putty; bulk jar; watercooling; nonconductive
Keywords: UPSIREN UX PRO Ultra, bulkthermal putty, 16.8 W/m·K*, nonconductive TIM, water cooling contact, coldplate gaps, 2–4 mm interface, desktop GPU, PS5 compatible, RTX 4080, RTX 4090,GDDR6X, VRM power stages, pumpout resistance, hand moldable, refurbishing,production bench, consistent texture, Thessaloniki EU, research funded
