High viscosity, hand moldable compound forwater cooling cold plates, desktop GPUs and consoles like PS5; 16.8 W/m·K*;forms a stable 2–4 mm interface where ordinary paste cannot maintain contact.
This 20 g jar is sized for a typical singleservice on one desktop GPU or one game console, including full VRAM/VRMcoverage at the recommended thickness. It’s easy to decant small portions forprecise placement, then reseal to keep the remaining compound clean for touchups.
Where water cooling excels in capacity, itoften struggles with contact: cold plates and component clusters rarely meetperfectly, and standard thermal paste cannot bridge millimeter-scale gaps. UXPRO Ultra solves this by holding a uniform 2–4 mm layer under clamp force,maintaining contact that paste alone can’t achieve so the loop’s coolingpotential reaches the parts that need it.
The compound is intentionally more viscousand only lightly tacky so you can shape it exactly where it’s needed. Use theprovided sleeves to knead a ribbon or pad between your fingers, place it on thecomponents, and press for a clean, even footprint. Once seated, it resistspumpout and creep through long gaming, mining or AI workloads. Produced inThessaloniki, Greece (European Union). The formulation was developed throughscientific research cofunded by Greece and the European Union.
Packet includes:
• 1 × 20 g jar of UPSIREN UX PRO Ultra thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves
*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).
Bullets:
• Water cooling ready: fills tolerances beneath cold plates where ordinarypaste cannot hold a thermal path, delivering loop performance directly toGDDR6/GDDR6X modules, VRM stages and controllers across wide, unevenfootprints.
• High viscosity, hand moldable body shapes to the exact zone you need, thenstays put under pressure; resists pumpout and creep during extended high temperatureoperation in gaming, mining and AI systems.
• Ideal for large gaps: creates a stable 2–4 mm interface around standoffs,frame edges and mixed height component clusters, eliminating guesswork withstacked pads and improving contact uniformity.
• Maximum possible thermal conductivity for a non-electrically conductive putty(16.8 W/m·K*), enabling efficient heat transfer while remaining electricallysafe around dense SMD layouts.
• 20 g capacity matched to one GPU or one console service; decant workingamounts for microscope jobs while keeping the remainder sealed to preservetexture, cleanliness and repeatability.
• UPSIREN UX PRO Ultra is compatible with PlayStation 5, Xbox Series X, NVIDIAGeForce RTX 3080/3090/4080/4090 graphics boards, and AMD Radeon RX6800/6900/7900 series cards, and other systems that use thermal pads or thermalputties.
Tags: thermal putty; water cooling; largegaps; nonconductive
Keywords: UPSIREN UX PRO Ultra, thermalputty, water cooling cold plate, 16.8 W/m·K*, nonconductive TIM, 2–4 mm layer,desktop GPU cooling, PS5 compatible, RTX 4090 compatible, GDDR6, GDDR6X, VRMcooling, pumpout resistant, hand moldable, high viscosity, uneven interfaces,mining rigs, gaming desktops, AI workstation, made in Greece
