UPSIREN UX PRO Ultra 50g jar – High-viscositynonconductive thermal putty for 2–4 mm gaps
Subtitle: Hand moldable compound for watercooling plates, desktop GPUs and consoles; 16.8 W/m·K*; maintains a stableinterface where standard paste cannot bridge tolerances.
The 50 g jar balances capacity and handlingfor recurring service without moving to full bulk. It’s straightforward todecant small portions for microscope work while keeping the main jar sealed topreserve texture and cleanliness over longer service cycles.
By holding a uniform 2–4 mm layer underclamp force, UX PRO Ultra turns the raw capacity of your loop or large heatsink into reliable component-level contact. The material is intentionally moreviscous and only lightly tacky: form a ribbon or pad using the includedsleeves, place it precisely, and press to create a clean, even footprint thatresists pumpout over time. Produced in Thessaloniki, Greece (European Union).The formulation was developed through scientific research cofunded by Greeceand the European Union.
Packet includes:
• 1 × 50 g jar of UPSIREN UX PRO Ultra thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves
*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).
Bullets:
• Engineered for water cooling and other big coolers: bridges coldplatetolerances that ordinary paste can’t, delivering real contact to GDDR6/GDDR6Xmodules, VRM stages and controllers.
• High viscosity, hand moldable body lets you shape the layer exactly whereneeded; remains cohesive under pressure and resists pumpout during prolonged high-temperatureoperation.
• Creates a stable 2–4 mm interface across mixed height component clusters andaround standoffs and frame edges, improving uniformity without stacked pads.
• Maximum possible thermal conductivity for a nonconductive putty (16.8 W/m·K*)while remaining electrically safe for dense SMD layouts.
• 50 g capacity suits small shops and frequent users; decant working amounts tominimize exposure and keep the main jar sealed for consistent texture overtime.
• UPSIREN UX PRO Ultra is compatible with PlayStation 5, Xbox Series X, NVIDIAGeForce RTX 3080/3090/4080/4090 boards, AMD Radeon RX 6800/6900/7900 series,and other systems that use thermal pads or putties.
Tags: thermal putty; water cooling; largegaps; nonconductive
Keywords: UPSIREN UX PRO Ultra, thermalputty, 16.8 W/m·K*, nonconductive TIM, water cooling contact, cold plateinterface, 2–4 mm layer, desktop GPU, PS5 compatible, RTX 3080, RTX 4090,GDDR6, GDDR6X, VRM cooling, pumpout resistant, hand moldable, workshop size,Thessaloniki Greece, EU made, research funded
